The proposed facility will bring together specialised technology, manufacturing know-how and engineering expertise to address next-generation semiconductor packaging requirements
Paras Semiconductors partners with US firm BroadPak to develop advanced packaging facility in India

The proposed facility will bring together specialised technology, manufacturing know-how and engineering expertise to address next-generation semiconductor packaging requirements
Key Takeaways
- Paras Semiconductors partners with US firm BroadPak to develop advanced packaging facility in India.
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Published originally on The Hindu Business Line






