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Paras Semiconductors partners with US firm BroadPak to develop advanced packaging facility in India

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Paras Semiconductors partners with US firm BroadPak to develop advanced packaging facility in India
Photo / Coverage: The Hindu Business Line
EXECUTIVE SUMMARY

The proposed facility will bring together specialised technology, manufacturing know-how and engineering expertise to address next-generation semiconductor packaging requirements

Key Takeaways

  • Paras Semiconductors partners with US firm BroadPak to develop advanced packaging facility in India.

The proposed facility will bring together specialised technology, manufacturing know-how and engineering expertise to address next-generation semiconductor packaging requirements

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Published originally on The Hindu Business Line

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