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Paras partners with US-based BroadPak to build advanced semiconductor packaging capabilities

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Paras partners with US-based BroadPak to build advanced semiconductor packaging capabilities
Photo / Coverage: The Hindu Business Line
EXECUTIVE SUMMARY

Through this partnership, Paras Semiconductors aims to establish an advanced heterogeneous integration and 3D packaging OSAT facility in India

Key Takeaways

  • Paras partners with US-based BroadPak to build advanced semiconductor packaging capabilities.

Through this partnership, Paras Semiconductors aims to establish an advanced heterogeneous integration and 3D packaging OSAT facility in India

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Published originally on The Hindu Business Line

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