Through this partnership, Paras Semiconductors aims to establish an advanced heterogeneous integration and 3D packaging OSAT facility in India
Paras partners with US-based BroadPak to build advanced semiconductor packaging capabilities

Through this partnership, Paras Semiconductors aims to establish an advanced heterogeneous integration and 3D packaging OSAT facility in India
Key Takeaways
- Paras partners with US-based BroadPak to build advanced semiconductor packaging capabilities.
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Published originally on The Hindu Business Line






